PCB Assembly Manufacturer Wireless Power Bank Charger Circuit Board

PCB Assembly Manufacturer Wireless Power Bank Charger Circuit Board PCBA CapacityPCB assembly Layers1 Layers to 12 layer (standard),PCB assembly material/typeFR4, Aluminum, CEM1, Supper-thin PCB, FPC/

  • Model: PCB Assembly Manufacturer Wireless Power Bank Charger Circuit Board

PCB Assembly Manufacturer Wireless Power Bank Charger Circuit Board

 

PCBA Capacity

PCB assembly Layers1 Layers to 12 layer (standard),
PCB assembly material/typeFR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
PCB Assembly service typeDIP/SMT or Mixed SMT & DIP
Copper thickness0.5um-4um
Assembly surface finishHASL,ENIG,OSP
PCB Dimension600x1200mm
IC Pitch(min)0.2mm
Chip Size(min)01005
Leg distance(min)0.3mm
PCB BGA Size8x6mm~55x55mm
IC Encapsulation typeSOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
u-BGA ball dia.0.2mm
Required Docs for PCBAGerber file with BOM list & Pick-N-Place File(XYRS)
SMT speedCHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs