PCBA/PCB Assembly Specification
1 Layers to 12 layer (standard),
FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger
Assembly service type
DIP/SMT or Mixed SMT & DIP
0.5 OZ-5 OZ
Assembly surface finish
HASL, HASL Lead Free, ENIG, OSP
u-BGA ball dia.
Required Docs for PCBA
Gerber file with BOM list & Pick-N-Place File(XYRS)
CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs
What we can do for you?
EMS-Electronic Manufacturing Service
PCB Supply and Layout
PCB Assembly on SMT, BGA and DIP
Cost Effective Components Sourcing
Fast Turn Prototype and Mass Production
Box Build Assembly
Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)
Logistics and After-sales Service
Detailed Terms for PCB Assembly
Professional Surface-mounting and Through-hole soldering Technology.
Various sizes like 1206,0805,0603 components SMT technology.
ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
PCB Assembly With UL,CE,FCC,Rohs Approval.
Nitrogen gas reflow soldering technology for SMT.
High Standard SMT&Solder Assembly Line.
High density interconnected board placement technology capacity.
Gerber file of the bare PCB board.
BOM (Bill of material) for assembly.
To short the lead time, please kindly advise us if there is any acceptable components substitution.
Testing Guide & Test Fixtures if necessary.
Programming files & Programming tool if necessary.
Schematic if necessary.