PCBA processing and welding process

2020-12-11 17:31:36

PCBA processing and welding process


PCBA processing process:




1. PCBA processing single-sided surface assembly process: solder paste printing-patch-reflow soldering;


2. PCBA processing double-sided surface assembly process: A side printing solder paste-patch-reflow soldering-flip board-B side printing solder paste-patch-reflow soldering;


PCBA processing


3. PCBA processing single-sided mixed assembly (SMD and THC are on the same side): solder paste printing-patch-reflow soldering-manual plug-in (THC)-wave soldering;


4. Single-sided mixed assembly (SMD and THC are respectively on both sides of the PCB): B side printing red glue-patch-red glue curing-flap-A side plug-in-B side wave soldering;


5. Double-sided mixing device (THC has SMD on side A and both sides A and B): Printed solder paste on side A-patch-reflow soldering-flipping board-printed red glue on side B-patch-red glue curing-flipping Board—A side plug-in—B side wave soldering;


6. Double-sided mixed packaging (SMD and THC on both sides of A and B): Printed solder paste on side A-patch-reflow soldering-flipping board-printing red glue on side B-patch-red glue curing-flipping board-A Surface plug-in—B-side wave soldering—B-side plug-in is attached.


In the soldering process, the variables with the smallest variables should belong to the machinery and equipment, so they are the first to be checked. In order to achieve the correctness of the inspection, an independent electronic device can be used to assist, such as using a thermometer to detect various temperatures and using an electric meter to accurately correct machine parameters .


Find out the most suitable operating conditions from actual operations and records. Note: In any case, try not to adjust the machine and equipment to overcome some short-term soldering problems. Such adjustments may lead to bigger problems.