Shenzhen Professional PCB Design/Layout FR4 Material Electronic USB PCB Board Assembly One Stop Service

Product Details PCB assembly Layers1 Layers to 12 layer (standard, including HDI board )PCB assembly material/typeFR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold fingerPCB Assembly service typeDIP/SMD

  • Model: Shenzhen Professional PCB Design/Layout FR4 Material Electronic USB PCB Board Assembly One Stop Service
Product Details

 

PCB assembly Layers

1 Layers to 12 layer (standard, including HDI board )

PCB assembly material/type

FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger

PCB Assembly service type

DIP/SMD or Mixed SMD & DIP

Base material thickness 0.2-3.6mm
Copper thickness 18um(H/HOZ),35um(1/1OZ),70um(2/2OZ),5OZ
Assembly surface finish Gold-plated, HASL,OSP, ENIG
PCB Dimension (max)500*700mm
IC Pitch(min)0.2mm
Chip size(min)01005
Drilled hole size(min)0.075mm
Track width/spacing(min)3mil 

IC Encapsulation type

SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA

Outline tolerance

±0.1mm

Hole diameter tolerance±0.076mm
Hole location tolerance±0.076mm
V-CUT tolerance±0.1mm
Warpaccording to the IPC-600F standard 
Required Docs for PCBAGerber file with BOM list & Pick-N-Place File(XYRS) 
Sample lead time Single side:2-3 working days, Double-side:3-4 working days, Multi-layer:8-10 working days