fast 94v-0 e170968 for alarm circuit board

PCBA/PCB Assembly SpecificationPCB Layers1 Layers to 12 layer (standard),PCB material/typeFR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold fingerAssembly service type DIP/SMT or Mixed SMT & DIPCoppe

  • Model: fast 94v-0 e170968 for alarm circuit board

PCBA/PCB Assembly Specification

  • PCB Layers

    1 Layers to 12 layer (standard),

    PCB material/type

    FR4, Aluminum, CEM1, Supper-thin PCB, FPC/Gold finger

    Assembly service type 

    DIP/SMT or Mixed SMT & DIP

    Copper thickness

    0.5 OZ-5 OZ

    Assembly surface finish

    HASL, HASL Lead Free, ENIG, OSP

    PCB Dimension

    600x1200mm

    IC Pitch(min)

    0.2mm

    Chip Size(min)

    0201

    Leg distance(min)

    0.3mm

    BGA Size

    8x6mm~55x55mm

    SMT Efficiency

    SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA

    u-BGA ball dia.

    0.2mm

    Required Docs for PCBA

    Gerber file with BOM list & Pick-N-Place File(XYRS) 

    SMT speed

    CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs

    What we can do for you?

    1. EMS-Electronic Manufacturing Service

    2. PCB Supply and Layout

    3. PCB Assembly on SMT, BGA and DIP

    4. Cost Effective Components Sourcing

    5. Fast Turn Prototype and Mass Production

    6. Box Build Assembly

    7. Engineering Support

    8. Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)

    9. Logistics and After-sales Service

Detailed Terms for PCB Assembly
Technical requirement:
  1. Professional Surface-mounting and Through-hole soldering Technology.

  2. Various sizes like 1206,0805,0603 components SMT technology.

  3. ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

  4. PCB Assembly With UL,CE,FCC,Rohs Approval.

  5. Nitrogen gas reflow soldering technology for SMT.

  6. High Standard SMT&Solder Assembly Line.

  7. High density interconnected board placement technology capacity.

Quote requirement: 
  1. Gerber file of the bare PCB board.

  2. BOM (Bill of material) for assembly.

  3. To short the lead time, please kindly advise us if there is any acceptable components substitution.

  4. Testing Guide & Test Fixtures if necessary.

  5. Programming files & Programming tool if necessary.

  6. Schematic if necessary.